Metal dialkyldithiophosphate intermediate transfer members

ABSTRACT

An intermediate transfer member includes a mixture of a polyimide, a metal dialkyldithiophosphate, a polysiloxane, and an optional conductive filler component.

This disclosure is generally directed to an intermediate transfer member that includes a metal dialkyldithiophosphate, and an intermediate transfer member that includes a mixture of a polyimide, a metal dialkyldithiophosphate, an optional polysifoxane, and an optional conductive component.

BACKGROUND

Intermediate transfer members, such as intermediate transfer belts selected for transferring a developed image in xerographic systems, are known. For example, there are known intermediate transfer members that include materials with characteristics that cause these members to become brittle, resulting in inadequate acceptance of the developed image and subsequent partial transfer of developed xerographic images to a substrate like paper.

A disadvantage relating to the preparation of an intermediate transfer member is that there is usually deposited a separate release layer on a metal substrate, and thereafter there is applied to the release layer the intermediate transfer member components, and where the release layer allows the components to be separated from the member by peeling or by the use of mechanical devices. Thereafter, the intermediate transfer member components are in the form of a film, which can be selected for xerographic imaging systems, or the film can be deposited on a supporting substrate like a polymer layer. The use of an intermediate release layer adds to the cost and time of preparation, and such a layer can modify a number of the intermediate transfer member characteristics.

Intermediate transfer members that enable acceptable registration of the final color toner image in xerographic color systems using synchronous development of one or more component colors, and using one or more transfer stations, are known. However, a disadvantage of using an intermediate transfer member, in color systems, is that a plurality of developed toner transfer operations is utilized, thus sometimes causing charge exchange between the toner particles and the transfer member, which ultimately can result in less than complete toner transfer. This can result in low resolution images on the image receiving substrate like paper, and image deterioration. When the image is in color, the image can additionally suffer from color shifting and color deterioration.

There is a need for intermediate transfer members that substantially avoid or minimize the disadvantages of a number of known intermediate transfer members.

Also, there is a need for intermediate transfer members with excellent wear and acceptable abrasion resistance, and which members possess improved stability with no or minimal degradation for extended time periods.

Moreover, there is a need for intermediate transfer member materials that possess self release characteristics from a number of substrates that are selected when such members are prepared.

Another need relates to intermediate transfer members that have excellent conductivity or resistivity, and that possess acceptable humidity insensitivity characteristics leading to developed images with minimal resolution issues.

Further, there is a need for intermediate transfer members containing components that can be economically and efficiently manufactured.

These and other needs are achievable in embodiments with the intermediate transfer members and components thereof disclosed herein.

SUMMARY

Disclosed is an intermediate transfer member comprising a metal dialkyldithiophosphate.

There is illustrated herein an intermediate transfer member comprising a mixture of a thermosetting polyimide, a zinc dialkyldithiophosphate, a polysiloxane, and a conductive filler component, and wherein said zinc dialkyldithiophosphate is of the following formulas/structures

wherein R₁, R₂, R₃ and R₄ are independently alkyl with from about 1 to about 10 carbon atoms.

There is illustrated herein an intermediate transfer member comprising a mixture of a thermosetting polyimide, a zinc dialkyldithiophosphate release agent, a polysiloxane, and a conductive filler component, and wherein said member possesses self release characteristics from metal substrates.

FIGURES

The following Figures are provided to further illustrate the intermediate transfer members disclosed herein.

FIG. 1 illustrates an exemplary embodiment of a one-layer intermediate transfer member of the present disclosure.

FIG. 2 illustrates an exemplary embodiment of a two-layer intermediate transfer member of the present disclosure.

FIG. 3 illustrates an exemplary embodiment of a three-layer intermediate transfer member of the present disclosure.

EMBODIMENTS

There is provided herein an intermediate transfer member comprising a metal dialkyldithiophosphate, such as a zinc dialkyldithiophosphate. The metal dialkyldithiophosphate enables or assists in enabling self release from a substrate like metal substrate, such as stainless steel, thereby avoiding the need for a separate release layer on the substrate.

More particularly, there is provided herein an intermediate transfer member comprising a mixture, in the configuration of a layer, of a polyimide, and more specifically, a thermosetting polyimide; a metal dialkyldithiophosphate, such as a zinc dialkyldithiophosphate, that enables or assists in enabling self release from a substrate like metal substrate, such as stainless steel, and where there is avoided the need for a separate release layer on the substrate.

In FIG. 1 there is illustrated an intermediate transfer member comprising a layer 2, comprised of a metal dialkyldithiophosphate 4, or a mixture of a polymer, such as a polyimide 3, a metal dialkyldithiophosphate 4, an optional siloxane polymer 5, and an optional conductive component 6.

In FIG. 2 there is illustrated a two-layer intermediate transfer member comprising a bottom layer 7, comprising a metal dialkyldithiophosphate 9, or a mixture of a polymer, such as a polyimide 8, a metal dialkyldithiophosphate 9, an optional siloxane polymer 10, and an optional conductive component 11, and an optional top or outer toner release layer 13 comprising release components 14.

In FIG. 3 there is illustrated a three layer intermediate transfer member comprising a supporting substrate 15, a layer thereover 16 comprising a metal dialkyldithiophosphate 18, or a mixture of a polymer, such as a thermosetting polyimide 17, a metal dialkyldithiophosphate 18, an optional siloxane polymer 19, and an optional conductive component 21, and an optional release layer 23 comprising release components 24.

There is disclosed a self-releasing intermediate transfer member that generally comprises a metal dialkyldithiophosphate, such as zinc dialkyldithiophosphate. In embodiments, the metal dialkyldithiophosphate can be mixed with a polymer material used to form an intermediate transfer member layer. Thus, in particular embodiments, there is disclosed a self-releasing intermediate transfer member that generally comprises a polyimide, a metal dialkyldithiophosphate, such as zinc dialkyldithiophosphate that primarily functions as an internal release agent, a polysiloxane polymer, and a conductive component like carbon black, and which member has excellent release and stability characteristics, smooth high quality surfaces, and improved mechanical properties.

The intermediate transfer members disclosed herein exhibit self release characteristics, and where the use of an external release layer present on, for example, a stainless steel substrate is avoided; have excellent mechanical strength while permitting the rapid and complete transfer from about 90 to about 99 percent, and from about 95 to about 100 percent transfer of a xerographic developed image; possess a Young's modulus of, for example, from about 3,000 to about 7,000 Mega Pascals (MPa), from about 3,600 to about 6,000 MPa, from about 3,500 to about 5,000 MPa, or from about 3,700 to about 4,000 MPa; a high glass transition temperature (T_(g)) of from about 200° C. to about 400° C., or from about 250° C. to about 375° C.; a CTE (coefficient of thermal expansion) of from about 20 to about 70 ppm/° K, or from about 30 to about 60 ppm/° K; and an excellent resistivity as measured with a known High Resistivity Meter of, for example, from about 10⁸ to about 10¹³ ohm/square, from about 10⁹ to about 10¹³ ohm/square, from about 10⁹ to about 10¹² ohm/square, or from about 10¹⁰ to about 10¹² ohm/square.

Self-release characteristics without the assistance of any external sources, such as prying devices, permits the efficient, economical formation, and full separation, from about 95 to about 100 percent, and from about 97 to about 99 percent of the disclosed intermediate transfer members from substrates, such as steel upon which the members are initially prepared in the form of a film, and where release materials and separate release layers can be avoided on the metal substrates. The time period to obtain the self-release characteristics varies depending, for example, on the components selected for the metal dialkyldithiophosphate containing mixtures disclosed. Generally, however, this time period is from about 1 to about 60 seconds, from about 1 to about 35 seconds, from about 1 to about 10 seconds, or from 1 to about 5 seconds, and in some instances less than about 1 second.

The intermediate transfer members of the present disclosure can be provided in any of a variety of configurations, such as a one-layer configuration, or in a multi-layer configuration including, for example, a top release layer. More specifically, the final intermediate transfer member may be in the form of an endless flexible belt, a web, a flexible drum or roller, a rigid roller or cylinder, a sheet, a drelt (a cross between a drum and a belt), a seamless belt that is with an absence of any seams or visible joints in the members, and the like.

As disclosed herein, the intermediate transfer member generally comprises a polymer layer formed from a mixture of materials, comprising at least a metal dialkyldithiophosphate, such as zinc dialkyldithiophosphate. In embodiments, the metal dialkyldithiophosphate can be mixed with a polymer material, such as a polyimide polymer material or precursor thereof, with other optional materials, such as a polysiloxane polymer, a conductive component, and the like.

Metal Dialkyldithiophosphates

The metal dialkyldithiophosphate incorporated into the intermediate transfer member material imparts self-release characteristics to the material. As such, when the intermediate transfer member is formed on an underlying substrate, the intermediate transfer member can self-release from the substrate.

Examples of metal dialkyldithiophosphates selected for the intermediate transfer member mixtures illustrated herein, and which dialkyldithiophosphates primarily function as an internal release agent, are metal dialkyldithiophosphates as represented by the following formulas/structures

wherein R₁, R₂, R₃ and R₄ are independently at least one of primary, secondary, and branched alkyls with, for example, from about 1 to about 18 carbon atoms, from about 1 to about 12 carbon atoms, from about 1 to about 15 carbon atoms, from about 1 to about 10 carbon atoms, from about 3 to about 8 carbon atoms, or from about 2 to about 8 carbon atoms.

Zinc dialkyldithiophosphates selected for the intermediate transfer members illustrated herein, and commercially available from Elco Corporation, are Elco 102, 103, 119, 121, 106 or 108. For example, Elco 102 is believed to be a mixed, primary zinc dialkyldithiophosphate, while Elco 103 is believed to be a mixed, primary and secondary zinc dialkyldithiophosphate.

Specific examples of zinc dialkyldithiophosphates that can be selected for the disclosed intermediate transfer members are selected from the group consisting of zinc dimethyldithiophosphate, zinc diethyldithiophosphate, zinc dipropyldithiophosphate, zinc dibutyldithiophosphate, zinc dipentyldithiophosphate, zinc dihexyldithiophosphate, zinc diheptyldithiophosphate, zinc dioctyl dithiophosphate, zinc dinonyldithiophosphate, zinc didecyldithiophosphate, and the like, and mixtures thereof.

Additionally, there can be selected as metal dialkyldithiophosphates for the disclosed intermediate transfer members disclosed herein antimony diamyldithiophosphate, molybdenum di(2-ethylhexyl)dithiophosphate, and the like; molybdenum dialkyldithiophosphates like MOLYVAN L™ (molybdenum di(2-ethylhexyl) phosphorodithioate), available from R.T. Vanderbilt Company, Inc., Norwalk, Conn.; antimony dialkyldithiophosphates, available from R.T. Vanderbilt Company, Inc., Norwalk, Conn., as VANLUBE 622™, 648™, and the like; other suitable metal dithiophosphates; and mixtures thereof.

The metal dialkyldithiophosphates can be present in the intermediate transfer member in an amount of about 100 percent, or the metal dialkyldithiophosphate containing mixture can be present in the intermediate transfer member in the ratios as illustrated herein and in various effective amounts, such as for example, from about 0.1 to about 10 weight percent, from about 0.5 to about 10 weight percent, from about 0.75 to about 5 weight percent, or from about 1 to about 7 weight percent, based on the weight of components or ingredients present in the coating mixture, such as of a coating mixture of a polyimide polymer, a metal dialkyldithiophosphate, a polysiloxane polymer, and when present a conductive component.

Polyimide Polymers

The intermediate transfer member can also generally comprise a polymeric film-forming material. Any suitable polymeric film-forming material can be used, such as a polyimide polymeric film-forming material.

Examples of the polyimides that can be included in the intermediate transfer mixture of the polyimide, the metal dialkyldithiophosphate, the polysiloxane, and the optional conductive filler component include known low temperature, and rapidly cured polyimide polymers, such as VTECT™ PI 1388, 080-051, 851, 302, 203, 201, and PETI-5, all available from Richard Blaine International, Incorporated, Reading, Pa. These thermosetting polyimides can be cured at temperatures of from about 180° C. to about 260° C. over a short period of time, such as from about 10 to about 120 minutes, or from about 20 to about 60 minutes, and generally have a number average molecular weight of from about 5,000 to about 500,000 or from about 10,000 to about 100,000, and a weight average molecular weight of from about 50,000 to about 5,000,000 or from about 100,000 to about 1,000,000. Also, for the intermediate transfer mixture there can be selected thermosetting polyimides that can be cured at temperatures above 300° C., such as PYRE M.L.® RC-5019, RC 5057, RC-5069, RC-5097, RC-5053, and RK-692, all commercially available from Industrial Summit Technology Corporation, Parlin, N.J.; RP-46 and RP-50, both commercially available from Unitech LLC, Hampton, Va.; DURIMIDE® 100, commercially available from FUJIFILM Electronic Materials U.S.A., Inc., North Kingstown, R.I.; and KAPTON® HN, VN and FN, all commercially available from E.I. DuPont, Wilmington, Del.

Additionally, suitable polyimides that may be selected for the disclosed intermediate transfer member mixtures are known thermosetting polyimides formed from the imidization, by heating and curing, of a polyamic acid, or a polyimide precursor. Examples of these thermosetting polyimides include the imidization of at least one of a polyamic acid of pyromellitic dianhydride/4,4′-oxydianiline, a polyamic acid of pyromellitic dianhydride/phenylenediamine, a polyamic acid of biphenyl tetracarboxylic dianhydride/4,4′-oxydianiline, a polyamic acid of biphenyl tetracarboxylic dianhydride/phenylenediamine, a polyamic acid of benzophenone tetracarboxylic dianhydride/4,4′-oxydianiline, a polyamic acid of benzophenone tetracarboxylic dianhydride/4,4′-oxydianiline/phenylenediamine, and the like, and mixtures thereof. The heating and curing may be at temperatures that are suitable to cause the imidization of the polyamic acid, which temperature is believed to be from about 235° C. to about 340° C., from about 260° C. to about 325° C., from about 275° C. to about 300° C., from about 260° C. to about 325° C., or from about 260° C. to about 325° C.

Commercially available examples of polyamic acids of pyromellitic dianhydride/4,4-oxydianilines are PYRE-ML® RC5019 (about 15 to about 16 weight percent in N-methyl-2-pyrrolidone, NMP), RC5057 (about 14.5 to about 15.5 weight percent in NMP/aromatic hydrocarbon, ratio of 80/20), and RC5083 (about 18 to about 19 weight percent in NMP/DMAc, ratio of 15/85), obtainable from Industrial Summit Technology Corporation, Parlin, N.J.; and DURIMIDE® 100, commercially available from FUJIFILM Electronic Materials U.S.A., Inc.

Examples of polyamic acids of biphenyl tetracarboxylic dianhydride/4,4′-oxydianilines that may be selected for the generation of the polyimides for the disclosed intermediate transfer members include U-VARNISH A, and VARNISH S (about 20 weight in NMP), both available from UBE America Inc., New York, N.Y. Polyamic acids of biphenyl tetracarboxylic dianhydride/phenylenediamine examples include PI-2610 (about 10.5 weight in NMP), and PI-2611 (about 13.5 weight in NMP), both available from HD MicroSystems, Parlin, N.J.

Further examples of polyimides that may be selected for the disclosed intermediate transfer member mixtures can be obtained from the curing at temperatures of from about 260° C. to about 325° C. of polyamic acids of benzophenone tetracarboxylic dianhydride/4,4′-oxydianilines, such as RP46 and RP50 (about 18 weight percent in NMP), both available from Unitech Corp., Hampton, Va. Commercially obtainable from HD MicroSystems, Parlin, N.J., examples of polyamic acids of benzophenone tetracarboxylic dianhydride/4,4′-oxydianiline/phenylenediamines that can be selected are PI-2525 (about 25 weight percent in NMP), PI-2574 (about 25 weight percent in NMP), PI-2555 (about 19 weight percent in NMP/aromatic hydrocarbon, ratio of 80/20), and PI-2556 (about 15 weight percent in NMP/aromatic hydrocarbon/propylene glycol methyl ether, ratio of 70/15/15).

Examples of polyamic acids or esters of polyamic acid that can be imidized by curing can be generated by the reaction of a dianhydride and a diamine. Suitable dianhydrides selected for the reaction include aromatic dianhydrides and aromatic tetracarboxylic acid dianhydrides, such as, for example, 9,9-bis(trifluoromethyl)xanthene-2,3,6,7-tetracarboxylic acid dianhydride, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, 2,2-bis(3,4-dicarboxyphenoxy)phenyl)hexafluoropropane dianhydride, 4,4′-bis(3,4-dicarboxy-2,5,6-trifluorophenoxy)octafluorobiphenyl dianhydride, 3,3′,4,4′-tetracarboxybiphenyl dianhydride, 3,3′,4,4′-tetracarboxybenzophenone dianhydride, di-(4-(3,4-dicarboxyphenoxy)phenyl)ether dianhydride, di-(4-(3,4-dicarboxyphenoxy)phenyl)sulfide dianhydride, di-(3,4-dicarboxyphenyl)methane dianhydride, di-(3,4-dicarboxyphenyl)ether dianhydride, 1,2,4,5-tetracarboxybenzene dianhydride, 1,2,4-tricarboxybenzene dianhydride, butanetetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, pyromellitic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 2,3,6,7-anthracene tetracarboxylic dianhydride, 1,2,7,8-phenanthrenetetracarboxylic dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 2,2′,3,3′-biphenyltetracarboxylic dianhydride, 3,3′,4-4′-benzophenonetetracarboxylic dianhydride, 2,2′,3,3′-benzophenonetetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, bis(2,3-dicarboxyphenyl)ether dianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, bis(2,3-dicarboxyphenyl)sulfone 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexachloropropane dianhydride, 1,1-bis(2,3-dicarboxyphenyl)ethane dianhydride, 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 4,4′-(p-phenylenedioxy)diphthalic dianhydride, 4,4′-(m-phenylenedioxy)diphthalic dianhydride, 4,4′-diphenylsulfidedioxybis(4-phthalic acid)dianhydride, 4,4′-diphenylsulfonedioxybis(4-phthalic acid)dianhydride, methylenebis(4-phenyleneoxy-4-phthalic acid)dianhydride, ethylidenebis(4-phenyleneoxy-4-phthalic acid)dianhydride, isopropylidenebis-(4-phenyleneoxy-4-phthalic acid)dianhydride, hexafluoroisopropylidenebis(4-phenyleneoxy-4-phthalic acid)dianhydride, and the like.

Exemplary diamines selected for the reaction with the dianhydrides include 4,4′-bis-(m-aminophenoxy)-biphenyl, 4,4′-bis-(m-aminophenoxy)-diphenyl sulfide, 4,4′-bis-(m-aminophenoxy)-diphenyl sulfone, 4,4′-bis-(p-aminophenoxy)-benzophenone, 4,4′-bis-(p-aminophenoxy)-diphenyl sulfide, 4,4′-bis-(p-aminophenoxy)-diphenyl sulfone, 4,4′-diamino-azobenzene, 4,4′-diaminobiphenyl, 4,4′-diaminodiphenylsulfone, 4,4′-diamino-p-terphenyl, 1,3-bis-(gamma-aminopropyl)-tetramethyl-disiloxane, 1,6-diaminohexane, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenylmethane, 1,3-diaminobenzene, 4,4′-diaminodiphenyl ether, 2,4′-diaminodiphenylether, 3,3′-diaminodiphenylether, 3,4′-diaminodiphenylether, 1,4-diaminobenzene, 4,4′-diamino-2,2′,3,3′,5,5′,6,6′-octafluoro-biphenyl, 4,4′-diamino-2,2′,3,3′,5,5′,6,6′-octafluorodiphenyl ether, bis[4-(3-aminophenoxy)-phenyl]sulfide, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]ketone, 4,4′-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)phenyl]-propane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 4,4′-d iaminodiphenyl sulfide, 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl sulfone, 4,4′-diaminodiphenylmethane, 1,1-di(p-aminophenyl)ethane, 2,2-di(p-aminophenyl)propane, 2,2-di(p-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, and the like, and mixtures thereof.

The dianhydride and diamine reactants can be selected in various suitable amounts, such as for example a weight ratio of dianhydride to diamine of from about 20:80 to about 80:20, from about 40/60 to about 60/40, and about a 50/50 weight ratio.

The polymeric film-forming material, such as a polyimide or precursor thereof, can be present in the intermediate transfer member mixture in the ratios as illustrated herein, and in various effective amounts, such as for example, from about 70 to about 97 weight percent, from about 70 to about 95 weight percent, from about 75 to about 95 weight percent, or from about 80 to about 90 weight percent, based on the weight of components present in the coating mixture, such as of a coating mixture of a polyimide polymer, a metal dialkyldithiophosphate, a polysiloxane polymer, and when present a conductive component.

Polysiloxane Polymers

The intermediate transfer member can also generally comprise a polysiloxane polymer. Examples of polysiloxane polymers selected for the intermediate transfer member mixture disclosed herein include known suitable polysiloxanes, such as a polyether modified polydimethylsiloxane, commercially available from BYK Chemical as BYK® 333, BYK® 330 (about 51 weight percent in methoxypropylacetate), and BYK® 344 (about 52.3 weight percent in xylene/isobutanol, ratio of 80/20); BYK®-SILCLEAN 3710 and BYK® 3720 (about 25 weight percent in methoxypropanol); a polyester modified polydimethylsiloxane, commercially available from BYK Chemical as BYK® 310 (about 25 weight percent in xylene) and BYK® 370 (about 25 weight percent in xylene/alkylbenzenes/cyclohexanone/monophenylglycol, ratio of 75/11/7/7); a polyacrylate modified polydimethylsiloxane, commercially available from BYK Chemical as BYK®-SILCLEAN 3700 (about 25 weight percent in methoxypropylacetate); a polyester polyether modified polydimethylsiloxane, commercially available from BYK Chemical as BYK® 375 (about 25 weight percent in di-propylene glycol monomethyl ether); and the like, and mixtures thereof.

The polysiloxane polymer, or copolymers thereof can be present in the intermediate transfer member mixture in various effective amounts, such as from about 0.01 to about 1 weight percent, from about 0.05 to about 1 weight percent, from about 0.05 to about 0.5 weight percent, or from about 0.1 to about 0.3 weight percent based on the weight of components present in the mixture, such as of the mixture of the polyimide polymer, the metal dialkyldithiophosphate, the polysiloxane polymer, and when present the conductive component.

Optional Fillers

Optionally, the intermediate transfer member may contain one or more fillers to, for example, alter and adjust the conductivity of the intermediate transfer member. Where the intermediate transfer member is a one layer structure, the conductive filler can be included in the metal dialkyldithiophosphate containing mixture disclosed herein. However, where the intermediate transfer member is a multi-layer structure, the conductive filler can be included in one or more layers of the member, such as in the supporting substrate, the polymer mixture layer coated thereon and in both the supporting substrate and the polymer mixture layer.

Any suitable filler can be used that provides the desired results. For example, suitable fillers include carbon blacks, metal oxides, polyanilines, other known suitable fillers, and mixtures of fillers.

Examples of carbon black fillers that can be selected for the intermediate transfer members illustrated herein include special black 4 (B.E.T. surface area=180 m²/g, DBP absorption=1.8 ml/g, primary particle diameter=25 nanometers) available from Evonik-Degussa, special black 5 (B.E.T. surface area=240 m²/g, DBP absorption=1.41 ml/g, primary particle diameter=20 nanometers), color black FW1 (B.E.T. surface area=320 m²/g, DBP absorption=2.89 ml/g, primary particle diameter=13 nanometers), color black FW2 (B.E.T. surface area=460 m²/g, DBP absorption=4.82 ml/g, primary particle diameter=13 nanometers), color black FW200 (B.E.T. surface area=460 m²/g, DBP absorption=4.6 ml/g, primary particle diameter=13 nanometers), all available from Evonik-Degussa; VULCAN® carbon blacks, REGAL® carbon blacks, MONARCH® carbon blacks and BLACK PEARLS® carbon blacks available from Cabot Corporation. Specific examples of conductive carbon blacks are BLACK PEARLS® 1000 (B.E.T. surface area=343 m²/g, DBP absorption=1.05 ml/g), BLACK PEARLS® 880 (B.E.T. surface area=240 m²/g, DBP absorption=1.06 ml/g), BLACK PEARLS® 800 (B.E.T. surface area=230 m²/g, DBP absorption=0.68 ml/g), BLACK PEARLS® L (B.E.T. surface area=138 m²/g, DBP absorption=0.61 ml/g), BLACK PEARLS® 570 (B.E.T. surface area=110 m²/g, DBP absorption=1.14 ml/g), BLACK PEARLS® 170 (B.E.T. surface area=35 m²/g, DBP absorption=1.22 ml/g), VULCAN® XC72 (B.E.T. surface area=254 m²/g, DBP absorption=1.76 ml/g), VULCAN® XC72R (fluffy form of VULCAN® XC72), VULCAN® XC605, VULCAN® XC305, REGAL® 660 (B.E.T. surface area=112 m²/g, DBP absorption=0.59 ml/g), REGAL® 400 (B.E.T. surface area=96 m²/g, DBP absorption=0.69 ml/g), REGAL® 330 (B.E.T. surface area=94 m²/g, DBP absorption=0.71 ml/g), MONARCH® 880 (B.E.T. surface area=220 m²/g, DBP absorption=1.05 ml/g, primary particle diameter=16 nanometers), and MONARCH® 1000 (B.E.T. surface area=343 m²/g, DBP absorption=1.05 ml/g, primary particle diameter=16 nanometers); and Channel carbon blacks available from Evonik-Degussa. Other known suitable carbon blacks not specifically disclosed herein may be selected as the filler or conductive component for the intermediate transfer members disclosed herein.

Examples of polyaniline fillers that can be selected for incorporation into the intermediate transfer members are PANIPOL™ F, commercially available from Panipol Oy, Finland; and known lignosulfonic acid grafted polyanilines. These polyanilines usually have a relatively small particle size diameter of, for example, from about 0.5 to about 5 microns; from about 1.1 to about 2.3 microns, or from about 1.5 to about 1.9 microns.

Metal oxide fillers that can be selected for the disclosed intermediate transfer members include, for example, tin oxide, antimony doped tin oxide, indium oxide, indium tin oxide, zinc oxide, and titanium oxide, and the like.

When present, the filler can be selected in an amount of, for example, from about 1 to about 60 weight percent, from about 3 to about 40 weight percent, from about 4 to about 30 weight percent, from about 10 to about 30 percent, and from about 5 to about 20 weight percent based on the total weight of the layer metal dialkyldithiophosphates mixture components in which the filler is included.

Optional Additional Polymers

In embodiments of the present disclosure, the intermediate transfer member mixture can further include an optional polymer that primarily functions as a binder. Examples of suitable additional polymers include a polyamideimide, a polycarbonate, a polyphenylene sulfide, a polyamide, a polysulfone, a polyetherimide, a polyester, a polyvinylidene fluoride, a polyethylene-co-polytetrafluoroethylene, and the like, and mixtures thereof.

When an additional polymer is selected, it can be included in the intermediate transfer members mixture in any desirable and effective amounts. For example, the polymer can be present in an amount of from about 1 to about 75 weight percent, from about 2 to about 45 weight percent, or from about 3 to about 15 weight percent, based on a total weight of the mixture components.

Optional Supporting Substrates

If desired, a supporting substrate can be included in the intermediate transfer member, such as beneath the metal dialkyldithiophosphate containing polymer mixture layer. The supporting substrate can be included to provide increased rigidity or strength to the intermediate transfer member.

The coating dispersion of the metal dialkyldithiophosphate containing mixture can be coated on any suitable supporting substrate material to form a dual layer intermediate transfer member. Exemplary supporting substrate materials include polyimides, polyamideimides, polyetherimides, mixtures thereof, and the like.

More specifically, examples of the intermediate transfer member supporting substrates are polyimides inclusive of known low temperature, and rapidly cured polyimide polymers, such as VTEC™ PI 1388, 080-051, 851, 302, 203, 201, and PETI-5, all available from Richard Blaine International, Incorporated, Reading, Pa., polyamideimides, polyetherimides, and the like The thermosetting polyimides can be cured at temperatures of from about 180° C. to about 260° C. over a short period of time, such as from about 10 to about 120 minutes, or from about 20 to about 60 minutes, and generally have a number average molecular weight of from about 5,000 to about 500,000 or from about 10,000 to about 100,000, and a weight average molecular weight of from about 50,000 to about 5,000,000 or from about 100,000 to about 1,000,000. Also, for the supporting substrate there can be selected thermosetting polyimides that can be cured at temperatures of above 300° C., such as PYRE M.L.® RC-5019, RC 5057, RC-5069, RC-5097, RC-5053, and RK-692, all commercially available from Industrial Summit Technology Corporation, Parlin, N.J.; RP-46 and RP-50, both commercially available from Unitech LLC, Hampton, Va.; DURIMIDE® 100, commercially available from FUJIFILM Electronic Materials U.S.A., Inc., North Kingstown, R.I.; and KAPTON® HN, VN and FN, all commercially available from E.I. DuPont, Wilmington, Del.

Examples of polyamideimides that can be selected as supporting substrates for the intermediate transfer members disclosed herein are VYLOMAX® HR-11NN (15 weight percent solution in N-methylpyrrolidone, T_(g)=300° C., and M_(w)=45,000), HR-12N2 (30 weight percent solution in N-methylpyrrolidone/xylene/methyl ethyl ketone=50/35/15, T₉=255° C., and M_(w)=8,000), HR-13NX (30 weight percent solution in N-methylpyrrolidone/xylene=67/33, T_(g)=280° C., and M_(w)=10,000), HR-15ET (25 weight percent solution in ethanol/toluene=50/50, T_(g)=260° C., and M_(w)=10,000), HR-16NN (14 weight percent solution in N-methylpyrrolidone, T_(g)=320° C., and M_(w)=100,000), all commercially available from Toyobo Company of Japan, and TORLON® AI-10 (T_(g)=272° C.), commercially available from Solvay Advanced Polymers, LLC, Alpharetta, Ga.

Examples of specific polyetherimide supporting substrates that can be selected for the intermediate transfer members disclosed herein are ULTEM® 1000 (T_(g)=210° C.), 1010 (T_(g)=217° C.), 1100 (T_(g)=217° C.), 1285, 2100 (T_(g)=217° C.), 2200 (T_(g)=217° C.), 2210 (T_(g)=217° C.), 2212 (T_(g)=217° C.), 2300 (T_(g)=217° C.), 2310 (T_(g)=217° C.), 2312 (T_(g)=217° C.), 2313 (T_(g)=217° C.), 2400 (T_(g)=217° C.), 2410 (T_(g) 217° C.), 3451 (T_(g)=217° C.), 3452 (T_(g)=217° C.), 4000 (T_(g)=217° C.), 4001 (T_(g)=217° C.), 4002 (T_(g)=217° C.), 4211 (T_(g)=217° C.), 8015, 9011 (T_(g)=217° C.), 9075, and 9076, all commercially available from Sabic Innovative Plastics.

Once formed, the supporting substrate can have any desired and suitable thickness. For example, the supporting substrate can have a thickness of from about 10 to about 300 microns, such as from about 50 to about 150 microns, or from about 75 to about 125 microns.

Optional Release Layer

If desired, an optional release layer can be included in the intermediate transfer member, such as over the metal dialkyldithiophosphate layer mixture illustrated herein. The release layer can be included to assist in providing toner cleaning and additional developed image transfer efficiency from a photoconductor to the intermediate transfer member.

When selected, the release layer can have any desired and suitable thickness. For example, the release layer can have a thickness of from about 1 to about 100 microns, about 10 to about 75 microns, or from about 20 to about 50 microns.

The optional release layer can comprise TEFLON®-like materials including fluorinated ethylene propylene copolymer (FEP), polytetrafluoroethylene (PTFE), polyfluoroalkoxy polytetrafluoroethylene (PFA TEFLON®), and other TEFLON®-like materials; silicone materials, such as fluorosilicones and silicone rubbers, such as Silicone Rubber 552, available from Sampson Coatings, Richmond, Va., (polydimethyl siloxane/dibutyl tin diacetate, 0.45 gram DBTDA per 100 grams polydimethyl siloxane rubber mixture, with a molecular weight M_(w) of approximately 3,500); and fluoroelastomers, such as those sold as VITON®, such as copolymers and terpolymers of vinylidenefluoride, hexafluoropropylene, and tetrafluoroethylene, which are known commercially under various designations as VITON A®, VITON E®, VITON E60C®, VITON E45®, VITON E430®, VITON B910®, VITON GH®, VITON B50®, VITON E45®, and VITON GF®, The VITON® designation is a Trademark of E.I. DuPont de Nemours, Inc. Two known fluoroelastomers are comprised of (1) a class of copolymers of vinylidenefluoride, hexafluoropropylene, and tetrafluoroethylene, known commercially as VITON A®; (2) a class of terpolymers of vinylidenefluoride, hexafluoropropylene, and tetrafluoroethylene, known commercially as VITON B®; and (3) a class of tetrapolymers of vinylidenefluoride, hexafluoropropylene, tetrafluoroethylene, and a cure site monomer, such as VITON GF®, having 35 mole percent of vinylidenefluoride, 34 mole percent of hexafluoropropylene, and 29 mole percent of tetrafluoroethylene with 2 percent cure site monomer. The cure site monomers can be those available from E.I. DuPont de Nemours, Inc. such as 4-bromoperfluorobutene-1,1,1-dihydro-4-bromoperfluorobutene-1,3-bromoperfluoropropene-1,1,1-dihydro-3-bromoperfluoropropene-1, or any other suitable, known, commercially available cure site monomers.

Intermediate Transfer Member Formation

The intermediate transfer member mixtures illustrated herein comprising a metal dialkyldithiophosphate, such as comprising a polyimide, a metal dialkyldithiophosphate, such as a zinc dialkyldithiophosphate, a polysiloxane, and an optional conductive filler component, can be formulated into an intermediate transfer member by any suitable method. For example, with known milling processes, uniform dispersions of the intermediate transfer member mixtures can be obtained, and then coated on individual metal substrates, such as a stainless steel substrate or the like, using known draw bar coating or flow coating methods. The resulting individual film or films can be dried at high temperatures, such as by heating the films at from about 100° C. to about 400° C., or from about 160° C. to about 300° C., for a suitable period of time, such as from about 20 to about 180 minutes, or from about 40 to about 120 minutes, while remaining on the substrates. After drying and cooling to room temperature, about 23° C. to about 25° C., the films self release from the steel substrates, that is the films release without any external assistance. The resultant intermediate transfer film product can have a thickness of, for example, from about 15 to about 150 microns, from about 20 to about 100 microns; or from about 25 to about 75 microns.

As metal substrates selected for the deposition of the mixture disclosed herein, there can be selected stainless steel, aluminum, nickel, copper, and their alloys, glass plates, and other conventional typical known materials.

Examples of solvents selected for formation of the intermediate transfer member mixtures, which solvents can be selected in an amount of, for example, from about 60 to about 95 weight percent, or from about 70 to about 90 weight percent of the total mixture components weight include alkylene halides, such as methylene chloride, tetrahydrofuran, toluene, monochlorobenzene, N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, methyl ethyl ketone, dimethylsulfoxide (DMSO), methyl isobutyl ketone, formamide, acetone, ethyl acetate, cyclohexanone, acetanilide, mixtures thereof, and the like. Diluents can be mixed with the solvents selected for the intermediate transfer member mixtures. Examples of diluents added to the solvents in amounts of from about 1 to about 25 weight percent, and from 1 to about 10 weight percent based on the weight of the solvent and the diluent are known diluents like aromatic hydrocarbons, ethyl acetate, acetone, cyclohexanone and acetanilide.

The intermediate transfer members illustrated herein can be selected for a number of printing and copying systems, inclusive of xerographic printing systems. For example, the disclosed intermediate transfer members can be incorporated into a multi-imaging xerographic machine where each developed toner image to be transferred is formed on the imaging or photoconductive drum at an image forming station, and where each of these images is then developed at a developing station, and transferred to the intermediate transfer member. The images may be formed on a photoconductor and developed sequentially, and then transferred to the intermediate transfer member. In an alternative method, each image may be formed on the photoconductor or photoreceptor drum, developed, and then transferred in registration to the intermediate transfer member. In an embodiment, the multi-image system is a color copying system, wherein each color of an image being copied is formed on the photoreceptor drum, developed, and transferred to the intermediate transfer member.

After the toner latent image has been transferred from the photoreceptor drum to the intermediate transfer member, the intermediate transfer member may be contacted under heat and pressure with an image receiving substrate such as paper. The toner image on the intermediate transfer member is then transferred and fixed, in image configuration, to the substrate such as paper.

Specific embodiments will now be described in detail. These examples are intended to be illustrative, and are not limited to the materials, conditions, or process parameters set forth in these embodiments. All parts are percentages by weight of total solids of all the components unless otherwise indicated. The viscosity values were determined by a viscometer.

Comparative Example 1

A coating composition was prepared by stirring a mixture of special carbon black 4 obtained from Degussa Chemicals, a polyimide of a polyamic acid of pyromellitic dianhydride/4,4′-oxydianiline available as PYRE-M.L.® RC-5019 from Industrial Summit Technology, and the polyester modified polydimethylsiloxane, available as BYK® 310 from BYK Chemical, in a ratio of 14/85.95/0.05 based on the initial mixture feed amounts, in N-methyl-2-pyrrolidone (NMP), about 13 weight solids. The obtained intermediate transfer member intermediate transfer member dispersion was coated on a stainless steel substrate of a thickness of 0.5 millimeter, and subsequently the mixture was cured by heating at 125° C. for 30 minutes, 190° C. for 30 minutes, and 320° C. for 60 minutes. The resulting intermediate transfer member comprised of the above components in the ratios indicated did not self release from the stainless substrate, but rather adhered to this substrate. After being immersed in water for 3 months, the intermediate transfer member obtained eventually self released from the substrate.

Example I

There was prepared by admixing with stirring, a coating composition comprising special carbon black 4, obtained from Degussa Chemical, a polyimide of a polyamic acid of pyromellitic dianhydride/4,4′-oxydianiline PYRE-M.L® RC-5019 obtained from Industrial Summit Technology, zinc dimethyldithiophosphate Elco 114 obtained from ELCO Corporation, and a polyester modified polydimethylsiloxane BYK® 310, obtained from BYK Chemical, in a ratio of 14/85.4510.5/0.05 based on the initial mixture feed amounts, in N-methyl-2-pyrrolidone, about 13 weight solids. The obtained intermediate transfer member coating dispersion was coated on a stainless steel substrate of a thickness of 0.5 millimeter, and subsequently the mixture was cured by heating at 125° C. for 30 minutes, 190° C. for 30 minutes, and 320° C. for 60 minutes. The resulting intermediate transfer member comprised of the above ingredients of special carbon black 4; the polyimide formed from the curing by heating of the intermediate containing mixture of the polyamic acid of pyromellitic dianhydride/4,4′-oxydianiline PYRE-M.L.® RC-5019; zinc dimethyldithiophosphate, and the polyester modified polydimethylsiloxane BYK® 310 in the ratios indicated, immediately self released from the stainless steel without the assistance of any external processes.

Example II

An intermediate transfer member is prepared by repeating the process of Example I except there is selected for the coating composition mixture the polyimide generated from a polyamic acid of biphenyl tetracarboxylic dianhydride/4,4′-oxydianiline (U-VARNISH A obtained from UBE America Inc.), a polyamic acid of biphenyl tetracarboxylic dianhydride/phenylenediamine (PI-2610 obtained from HD MicroSystems), a polyamic acid of benzophenone tetracarboxylic dianhydride/4,4′-oxydianiline (RP50 obtained from Unitech Corp.), or a polyamic acid of benzophenone tetracarboxylic dianhydride/4,4′-oxydianiline/phenylenediamine (PI-2525 obtained from HD MicroSystems).

Example III

An intermediate transfer member is prepared by repeating the process of Example T except that the zinc dimethyldithiophosphate is replaced by molybdenum di(2-ethylhexyl)phosphorodithioate MOLYVAN L™, obtained from R.T. Vanderbilt Company, Inc., or is replaced by an antimony dimethylphosphorodithioate VANLUBE 622™, obtained from R.T. Vanderbilt Company, Incorporated.

Measurements

The above intermediate transfer members of Example T and the Comparative Example 1 were measured for Young's Modulus following the known ASTM D882-97 process. Samples (0.5 inch×12 inch) of each intermediate transfer member were placed in the Instron Tensile Tester measurement apparatus, and then the samples were elongated at a constant pull rate until breaking. During this time, there was recorded the resulting load versus the sample elongation. The Young's Modulus was calculated by taking any point tangential to the initial linear portion of the recorded curve results and dividing the tensile stress by the corresponding strain. The tensile stress was calculated by the load divided by the average cross sectional area of each of the test samples. The results are provided in Table 1.

The surface resistivity of the above intermediate transfer members of Example I and Comparative Example 1 were also measured using a High Resistivity Meter, and the results are provided in Table 1.

TABLE 1 Surface Resistivity Young's Release Time from the (ohm/sq) Modulus (MPa) Metal Substrate Comparative 5.4 × 10¹⁰ 3,700 Did not release; needs to Example 1 be immersed in water for 3 months prior to being released. Example I 5.8 × 10¹⁰ 3,800 Excellent; released in 10 seconds.

Incorporation of the zinc dimethyldithiophosphate into the intermediate transfer member had substantially no negative impacts on both mechanical and electrical properties of the intermediate transfer member.

Also, the intermediate transfer member of Example I self released quickly from the substrate without the need to apply an additional release layer on the stainless steel, while the Comparative Example 1 did not self release and remained on the stainless steel substrate, being released only after immersed in water for three months.

The intermediate transfer members of Example I and Comparative Example 1 were further tested for their thermal expansion coefficients (CTE) using a Thermo-mechanical Analyzer (TMA). The intermediate transfer member samples were cut using a razor blade and metal die to 4 millimeter wide pieces which were then mounted between the TMA clamp using a measured 8 millimeter spacing. The samples were preloaded to a force of 0.05 Newtons (N). Data was analyzed from the 2^(nd) heat cycle. The CTE value was obtained as a linear fit through the data between the temperature points of interest of from about a −20° C. to about 50° C. regions using the TMA software.

The CTE for the Example I member was about 33.5 ppm/° K, which was similar to the Comparative Example 1 member with a CTE of about 35.1 ppm/° K.

The Example I intermediate transfer member was obtained at a lower cost, about 50 percent lower than a number of known intermediate transfer members that were free of the zinc dimethyldithiophosphate in that the Example I member does not require an added release layer coating on a stainless steel substrate when the member is initially prepared.

After being released from the stainless steel substrate, the Example I intermediate transfer film obtained can be used as an intermediate transfer member or the film obtained can be coated on a supporting substrate of a polymer like a polyamide.

The claims, as originally presented and as they may be amended, encompass variations, alternatives, modifications, improvements, equivalents, and substantial equivalents of the embodiments and teachings disclosed herein, including those that are presently unforeseen or unappreciated, and that, for example, may arise from applicants/patentees and others. Unless specifically recited in a claim, steps or components of claims should not be implied or imported from the specification or any other claims as to any particular order, number, position, size, shape, angle, color, or material. 

1. An intermediate transfer member comprising a metal dialkyldithiophosphate.
 2. An intermediate transfer member in accordance with claim 1 comprising a mixture of a polyimide, the metal dialkyldithiophosphate, a polysiloxane, and an optional conductive filler component.
 3. An intermediate transfer member in accordance with claim 1 further including a polymer layer selected from the group consisting of a fluorinated ethylene propylene copolymer, a polytetrafluoroethylene, a polyfluoroalkoxy polytetrafluoroethylene, a fluorosilicone, a terpolymer of vinylidene fluoride, hexafluoropropylene, and tetrafluoroethylene, and mixtures thereof.
 4. An intermediate transfer member in accordance with claim 2 wherein the polyimide is a thermosetting polyimide, and the metal dialkyldithiophosphate is a zinc dialkyldithiophosphate.
 5. An intermediate transfer member in accordance with claim 4 wherein the thermosetting polyimide is generated from curing at a temperature of from about 260° C. to about 325° C. a polyamic acid selected from the group consisting of the polyamic acid of biphenyl tetracarboxylic dianhydride/4,4′-oxydianiline and a polyamic acid of pyromellitic dianhydride/4,4′-oxydianiline.
 6. An intermediate transfer member in accordance with claim 4 wherein the thermosetting polyimide is generated from curing of a component selected from the group consisting of a polyamic acid of pyromellitic dianhydride/4,4′-oxydianiline, a polyamic acid of pyromellitic dianhydride/phenylenediamine, a polyamic acid of biphenyl tetracarboxylic dianhydride/4,4′-oxydianiline, a polyamic acid of biphenyl tetracarboxylic dianhydride/phenylenediamine, a polyamic acid of benzophenone tetracarboxylic dianhydride/4,4′-oxydianiline, a polyamic acid of benzophenone tetracarboxylic dianhydride/4,4′-oxydianiline/phenylenediamine, and mixtures thereof.
 7. An intermediate transfer member in accordance with claim 2 wherein the alkyl of said metal dialkyldithiophosphate contains from 1 to about 12 carbon atoms.
 8. An intermediate transfer member in accordance with claim 2 wherein the alkyl of said metal dialkyldithiophosphate is methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, or octyl.
 9. An intermediate transfer member in accordance with claim 2 wherein the metal dialkyldithiophosphate is represented by the following formulas/structures

wherein R₁, R₂, R₃ and R₄ are independently alkyl groups.
 10. An intermediate transfer member in accordance with claim 9 wherein R₁, R₂, R₃ and R₄ are independently a primary alkyl, a secondary alkyl, or a branched alkyl.
 11. An intermediate transfer member in accordance with claim 9 wherein the metal dialkyldithiophosphate is zinc dimethyldithiophosphate.
 12. An intermediate transfer member in accordance with claim 10 wherein said alkyl contains from about 1 to about 15 carbon atoms.
 13. An intermediate transfer member in accordance with claim 10 wherein said alkyl contains from about 3 to about 8 carbon atoms.
 14. An intermediate transfer member in accordance with claim 2 wherein the polysiloxane is a polyether modified polydimethylsiloxane, a polyester modified polydimethylsiloxane, a polyacrylate modified polydimethylsiloxane, or a polyester polyether modified polydimethylsiloxane.
 15. An intermediate transfer member in accordance with claim 2 wherein for each ingredient of the mixture, the polyimide is present in an amount of from about 70 to about 95 weight percent, the metal dialkyldithiophosphate is present in an amount of from about 0.1 to about 10 weight percent, the polysiloxane is present in an amount of from about 0.05 to about 1 weight percent, and the conductive filler component is present in an amount of from about 3 to about 40 weight percent, with the total of ingredients being about 100 percent.
 16. An intermediate transfer member in accordance with claim 2 wherein the member has a resistivity of from about 10⁹ to about 10¹³ ohm/square.
 17. An intermediate transfer member comprising a mixture of a thermosetting polyimide, a zinc dialkyldithiophosphate, a polysiloxane, and a conductive filler component, and wherein said zinc dialkyldithiophosphate is of the following formulas/structures

wherein R₁, R₂, R₃ and R₄ are independently alkyl with from about 1 to about 10 carbon atoms.
 18. An intermediate transfer member in accordance with claim 17 wherein the alkyl contains from about 1 to about 8 carbon atoms, and said polysiloxane is a polyester modified polydimethylsiloxane.
 19. An intermediate transfer member in accordance with claim 17 wherein the zinc dialkyldithiophosphate is selected from the group consisting of zinc dimethyldithiophosphate, zinc diethyldithiophosphate, zinc dipropyldithiophosphate, and zinc dibutyldithiophosphate.
 20. An intermediate transfer member comprising a mixture of a thermosetting polyimide, a zinc dialkyldithiophosphate release agent, a polysiloxane, and a conductive filler component, and wherein said member possesses self release characteristics from metal substrates. 